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Resources2018-10-03T22:27:49+00:00

Glossary of Terms

Below is a glossary of commonly used terms in the Microelectronics and Packaging Industry. 

ADC2017-03-23T19:47:56+00:00

ADC / Analog-to-Digital Converter

In electronics, an analog-to-digital converter (ADC, A/D, A–D, or A-to-D) is a system that converts an analog signal into a digital signal. A digital-to-analog converter (DAC) performs the reverse function.

An ADC may also provide an isolated measurement such as an electronic device that converts an input analog voltage or current to a digital number proportional to the magnitude of the voltage or current. Typically the digital output will be a two’s complement binary number that is proportional to the input, but there are other possibilities.

There are several ADC architectures. Due to the complexity and the need for precisely matched components, all but the most specialized ADCs are implemented as integrated circuits (ICs).

AOI2017-03-23T19:48:02+00:00

AOI / Automated Optical Inspection – is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew).

ASEP2017-03-23T19:48:10+00:00

ASEP / Application Specific Electronics Packaging

ASIC2018-10-03T22:28:02+00:00
ASIC

ASIC / Application-Specific Integrated Circuit – is an integrated circuit (IC) customized for a particular use, rather than intended for general-purpose use. For example, a chip designed to run in a digital voice recorder or a high-efficiency Bitcoin miner is an ASIC. Application-specific standard products (ASSPs) are intermediate between ASICs and industry standard integrated circuits.

BGA2017-03-23T19:48:23+00:00

BGA / Ball Grid Array

See also, BGA Reballing

Component2017-03-23T19:48:29+00:00

Component

 

CTE2017-03-23T19:48:35+00:00

CTE / Co-Efficient Thermal Expansion – When materials are heated, their size and volume increase in small increments, in a phenomenon known as thermal expansion. Expansion values vary depending on the material being heated. The coefficient ratio of thermal expansion indicates how much a material expands per 1 oC (2.2 oF) rise in temperature.

 

DAC2017-03-23T19:48:40+00:00

DAC / Digital-to-Analog Converter

 

DFM2017-03-23T19:48:48+00:00

DFM / Design for Manufacture

 

DFR2017-03-23T19:48:54+00:00

DFR / Design for Reliability

 

DFT2017-03-23T19:49:00+00:00

DFT / Design for Test

 

Die Stacking2017-03-23T19:49:05+00:00

Die Stacking

 

DIP2017-03-23T19:49:11+00:00

DIP – Dual In-line Package

Fan-Out2017-03-23T19:49:16+00:00

Fan-Out – In digital electronics, the fan-out of a logic gate output is the number of gate inputs.

 

 

Flexible Electronics2017-03-23T19:49:22+00:00

Flexible Electronics – Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic.

 

 

FlexFrame™2017-03-23T19:49:28+00:00

FlexFrame

 

Flip Chip2017-03-23T19:49:33+00:00

Flip Chip

 

FPGA2017-03-23T19:49:40+00:00

FPGA – Field Programmable Gate Array

 

HiLo™2017-03-23T19:49:47+00:00

HiLo

 

IC Obsolescence2017-03-23T19:49:53+00:00

IC Obsolescence

 

IC Package2017-03-23T19:49:58+00:00

IC Package

 

Interposer2017-03-23T19:50:07+00:00

Interposer

 

ITAR2017-03-23T19:50:12+00:00

ITAR / International Traffic in Arms Regulations

 

Leadframe2017-03-23T19:50:17+00:00

Leadframe

 

LGA2017-03-23T19:50:24+00:00

LGA / Land Grid Array

 

Microelectronics2017-03-23T19:50:29+00:00

Microelectronics

 

MID2017-03-23T19:50:35+00:00

MID / Molded Interconnect Device

 

Mixed Assembly2017-03-23T19:50:40+00:00

Mixed Assembly

 

MMCM2017-03-23T19:50:45+00:00

MCMM / Multi-Component Memory Module

 

Module2017-03-23T19:50:50+00:00

Module

 

NRE2017-03-23T19:50:59+00:00

NRE / Non Reoccurring Engineering – is a one time engineering effort by a vendor that is paid for by a customer. NRE is driven by a feature or capability that a product lacks and a customer wants enough to pay for.

 

Overmold2017-03-23T19:51:05+00:00

Overmold

PGA2017-03-23T19:51:10+00:00

PGA / Pin Grid Array

 

Pitch2017-03-23T19:51:15+00:00

Pitch

 

PPGA2017-03-23T19:51:21+00:00

PPGA / Plastic Pin Grid Array

 

QFP2017-03-23T19:51:26+00:00

QFP / Quad Flat Package

 

Reballing2017-03-23T19:51:31+00:00

Reballing – A reflow heats up the solder in order to get it malleable enough to reform a broken connection, but the resulting connection still isn’t as strong as it was originally. A reball means that someone completely removes the old solder from the motherboard and chip and reattaches the chip with new solder balls.

 

Respin2017-03-23T19:51:36+00:00

Respin

RoHS2017-03-23T19:51:43+00:00

RoHS / Restriction of Hazardous Substances Directive – The Restriction of Hazardous Substances Directive 2002/95/EC, (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Union.

  • RoHS is often referred to (inaccurately) as the ‘lead-free directive’, but it restricts the use of the following ten substances:
  1. Lead (Pb)
  2. Mercury (Hg)
  3. Cadmium (Cd)
  4. Hexavalent chromium (Cr6+)
  5. Polybrominated biphenyls (PBB)
  6. Polybrominated diphenyl ether (PBDE)
  7. Bis(2-ethylhexyl) phthalate (DEHP)
  8. Butyl benzyl phthalate (BBP)
  9. Dibutyl phthalate (DBP)
  10. Diisobutyl phthalate (DIBP)

Ruggedize2018-10-03T22:28:02+00:00

To ruggedize electronics is to add a level of protection for electronic components to ensure shock and vibration do not cause failure. Electronics overmolding is a specialty of ISI, which is the application of thermoset encapsulation, which is an epoxy overmold process which uses tooling to form a protective barrier around an electronic part.

 

Semiconductor2017-03-23T19:51:53+00:00

Semiconductor

SiP2017-03-23T19:51:58+00:00

SiP – System in Package

Socket2017-03-23T19:52:10+00:00

Socket

SOIC2017-03-23T19:52:15+00:00

SOIC

SOJ2017-03-23T19:52:20+00:00

SOJ

SMT2017-03-23T19:52:26+00:00

SMT – Surface Mount Technology

Substrate2017-03-23T19:52:58+00:00

Substrate

TSOP2017-03-23T19:52:46+00:00

TSOP

Underfill2017-03-23T19:52:52+00:00

Underfill

Wafer Dicing2017-03-23T19:53:03+00:00

Wafer Dicing

Wave Soldering2017-03-23T19:53:11+00:00

Wave Soldering – Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave.

Wirebond2017-03-23T19:53:16+00:00

Wirebond – 

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