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Our expertise enables the seamless integration of smart sensors into our customized microelectronic modules, elevating the capabilities of our solutions across diverse industrial and commercial applications. Our team is adept at incorporating a sophisticated mix of components, ranging from bare-die devices to active and passive components.
Ultra-dense, SWaP-optimized microelectronic assemblies.
Survive harsh environments;
Temperature cycle, shock, and vibration.
Integration of sensors with microelectronic modules.
Multi-component modules in standard IC form factor
(BGA, QFP, etc.).
Replace obsolete ICs with a form/fit/function equivalent module.
Your message will go to our in-house technical sales team. We typically get back within one business day.