System-in-Package (SiP)

Powerful Capabilities in a Compact Form-factor

Densely Packed, Efficient, and Capable

A “System-in-Package” (SiP) is a method by which multiple integrated circuits (ICs), along with other components such as resistors, capacitors, and sometimes passive devices, are assembled into a single package. This approach allows for the integration of different functional blocks or entire systems within a compact form factor.

SiP offers advantages such as reduced footprint, shorter interconnection paths between components, and potentially improved performance due to the close proximity of integrated functions. SiP is often used to address space constraints, enhance system integration, and improve overall efficiency in electronic designs. It’s particularly beneficial in applications where size, weight, and power considerations are critical, such as in mobile devices, wearables, and Internet of Things (IoT) devices.

System in package module
System in package module
System-in-package module
System-in-package module

Applications for Systems-in-Package

System-in-Package can be an appropriate solutions for a wide range of applications. Our team has advanced design and manufacturing capabilities to effectively address our customers’ most critical requirements and complex challenges in developing custom SiP modules.       


  • Radar Systems
  • Communications Systems
  • Unmanned Aerial Vehicles (UAVs)
  • Electronic Warfare Systems
  • Guidance and Control Systems


  • Satellite Systems
  • Avionics Systems
  • Spacecraft Electronics
  • Remote Sensing Systems


  • Medical Devices
  • Automotive Electronics
  • Internet of Things (IoT) Devices
  • Wearable Technology
  • Mobile Devices

Beyond equipment and process flow—our projects are most successful when we deeply collaborate and engage with our customers.

Case Studies

Our best success stories involve:

COLLABORATION Your engineering team working with ours as peers to solve a problem like shrinking a small board down to the size of a coin.

ENGAGEMENT Customers don't see us as just a contract manufacturer. Our value comes from our design engineering, like optimizing for cost or environmental conditions. Tap into our long history of successful projects by engaging with us early—and with your toughest challenges. We're ready!

End-to-End Microelectronic Development Expertise

miniaturized BGA on fingertip
electronics overmolding encapsulation
smart sensor module
System in package module
ic interposer replacement device

Ultra-dense, SWaP-optimized microelectronic assemblies. 

Survive harsh environments;
Temperature cycle, shock, and vibration.

Integration of sensors with microelectronic modules.

Multi-component modules in standard IC form factor
(BGA, QFP, etc.).

Replace obsolete ICs with a form/fit/function equivalent module.

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