Design Capabilities

System Level Engineering | PCB & Substrate Design | Packaging | Interconnect

ISI's Core Design Competencies

Our core areas of design competencies enable our team to provide innovative solutions for the most challenging microelectronics applications. Designing for manufacturability and assembly are both important factors that must be considered early in the development process. Our cross-functional team approaches each project to critically challenge every design at all levels (component, sub-system, system, and holistic levels) to ensure the end-product is optimized for manufacturability and cost.

System Level Engineering

PCB & Substrate Design

Advanced Packaging

Interconnect

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