Design Capabilities

System Level Engineering | PCB & Substrate Design | Packaging | Interconnect

ISI's Core Design Competencies

Our core areas of design competencies enable our team to provide innovative solutions for the most challenging microelectronics applications. Designing for manufacturability and assembly are both important factors that must be considered early in the development process. Our cross-functional team approaches each project to critically challenge every design at all levels (component, sub-system, system, and holistic levels) to ensure the end-product is optimized for manufacturability and cost.
BGA closeup image

System Level Engineering

PCB & Substrate Design

PCB substrate design

Advanced Packaging


Connector image

Contact ISI

Connect with our technical sales team today

Contact Us

Your message will go to our in-house technical sales team. We typically get back within one business day.