Skip to content
Contact
Support
Blog
Menu
Contact
Support
Blog
Search
Search
Solutions
FPGA Modules
Miniaturization
Ruggedization
Smart Sensors
System-in-Package (SiP)
IC Lifecycle Management
Standard Products
RFSoC Cards
XMC FPGA Cards
MICTOR Cables/Adapters
Pogo Pin Catalog
Standard Connectors
Capabilities
FPGA Systems
Design
Electronics Manufacturing
Advanced Packaging
Electronics Overmolding
IC Interposers & Adapters
BGA Reballing
Interconnect
Resources
Case Studies
Blog
Ruggedization Study
Interposer Guide [PDF]
About
About ISI
Working with ISI
Contact ISI
Support
Certifications
Careers
Menu
Solutions
FPGA Modules
Miniaturization
Ruggedization
Smart Sensors
System-in-Package (SiP)
IC Lifecycle Management
Standard Products
RFSoC Cards
XMC FPGA Cards
MICTOR Cables/Adapters
Pogo Pin Catalog
Standard Connectors
Capabilities
FPGA Systems
Design
Electronics Manufacturing
Advanced Packaging
Electronics Overmolding
IC Interposers & Adapters
BGA Reballing
Interconnect
Resources
Case Studies
Blog
Ruggedization Study
Interposer Guide [PDF]
About
About ISI
Working with ISI
Contact ISI
Support
Certifications
Careers
Capabilities
Interconnect, Advanced Packaging, Design, and Manufacturing
Our
IN HOUSE
capabilities from our California facility are ready for
fast turn
protos and
production
Interconnect
Custom and Standard Connectors, Pogo Pins, and Cables
Click Here
Advanced Packaging
Microelectronics Assembly, Wirebonding, and Encapsulation
Click Here
Design
System Level Engineering, PCB & Substrate Design, Packaging, and Interconnect
Click Here
Manufacturing
Vertically Integrated, US-Based, ITAR-Compliant Manufacturing Facility
Click Here