Audited and Qualified BGA Reballing
Supplier to Tier1 Defense Contractors
Most semiconductor suppliers have converted to lead-free packaging, creating reliability and compatibility dilemmas for military, aerospace and hi-rel applications. ISI’s process of BGA reballing services involves the removal of lead-free (RoHS) solder spheres then attaching leaded Sn63Pb37 eutectic spheres. ISI offers solutions to meet any customer’s configuration requirements.
Why Choose ISI for BGA Reballing?
Certified to meet stringent industry criteria
We perform reballing on 100,000+ BGAs per year
Cost-effective for high volume applications
Any pitch, any package, any alloy
Expedited 3-5 day turn time available
Precision and Temperature Sensitivity
100% automated optical inspection for true position, flatness and co-planarity
All processes in accordance with IPC/JEDEC J-STD sensitivity levels
Component temperature exposure is minimized during the ball removal process
All parts are reballed using a custom temperature profile in a nitrogen environment
ISI's 10-Step Certified BGA Reballing Conversion Process
Incoming inspection procedures per Quality Assurance Procedures (QAP)
Moisture Sensitivity Level (MSL) requirements are observed and followed
Deballing process is specified based on the component
Reballing utilizes high-accuracy assembly tooling for ball placement
Reflow solder profiles customized for each component
Post-ball attach cleaning procedures are monitored and measured using an ionograph
Part marking available per customer specifications on request
True position, co-planarity, and flatness are measured using automated optical inspection equipment
Final inspection per QAP
Packaging options: either customer supplied, JEDEC trays or tape and reel