Intel Atom Processor + DDR 3 Memory

Bare module before overmolding

Microprocessor + Memory Module (SiP)

Compute module for control systems on commercial aircraft

Modularization allows re-use of module in multiple applications on multiple aircraft

Lifecycle Management: Module configuration allows for future IC upgrades, while maintaining original footprint

Module was ruggedized with overmolding including integrated heat spreader 

Core Capabilities:




40mm x 45mm ovemolded BGA with heat spreader
module at scale next to US quarter coin
Final package is 40mm x 45mm ovemolded BGA with heat spreader

ISI's Co-Development Process

Working with the ISI team is a highly collaborative engagement. The initial requirements customers bring are the starting point, but the big benefit comes as our engineers work to propose various solutions, including pros and cons of each. Those solutions include what many competitors can’t offer, which is in-house execution of nearly all aspects of the project.

Exchange technical details with customer to define challenges and establish scope of the project. 

Assess likelihood of achieving the desired outcome and estimate the required engineering effort.

A quote will be issued to include NRE charges, price for prototypes and production volumes, and timeline for completion.

Design work begins with a particular focus on manufacturability. Frequent technical exchanges with the customer ensure a design that meets their expectations.

Upon customer approval, ISI initiates orders with suppliers and starts developing tools, molds, fixtures, and other custom equipment as required.

After satisfactory prototype testing and customer approval, product is released for volume production. 

Contact Us

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