Mastering Miniaturization: 5 Key Considerations for Smaller Electronic Modules

In the realm of electronic engineering, the pursuit of miniaturization represents a constant challenge and opportunity. At ISI, we’ve honed our expertise in miniaturizing circuitry and producing highly capable electronic modules that defy traditional size constraints. In this blog post, we’ll identify and address the five most important design and manufacturing considerations that underpin our […]

Aircraft Engine Control System

Aircraft photo

CASE STUDY: Aircraft Engine Control System Compact and flexible solution also reduced costs The customer had an aircraft engine control system common to several engine platforms.  The control system monitored and controlled RPM, temperature, vibration, cycles, position, and other critical parameters to optimize engine performance.  The control system was comprised of several sensor boards and […]

PCB Design and Layout Expertise at the Heart of Miniaturization

PCB board close-up

The key to a high-quality, reliable microelectronics solution is a well-thought-out PCB design. This blog post outlines the essential elements of our Design and Development disciplines that distinguish ISI from design firms, PCB fabricators, and contract manufacturers.

Infrared Camera Image Pre-Processor

Infared camera module compared to US quarter

CASE STUDY: IR Camera Image Pre-Processor Image Pre-Processor Module Today’s silicon memory and processor solutions are getting increasingly complex. Couple that with the challenges of miniaturization, and you are faced with much more engineering work to arrive at a reliable, commercially viable solution. This case study focuses on an image pre-processing module for an infrared […]

Intel Atom Processor and DDR 3 Memory

Bare module before overmolding

CASE STUDY: Intel Atom Processor + DDR 3 Memory Bare module before overmolding Microprocessor + Memory Module (SiP) Compute module for control systems on commercial aircraft Modularization allows re-use of module in multiple applications on multiple aircraft Lifecycle Management: Module configuration allows for future IC upgrades, while maintaining original footprint Module was ruggedized with overmolding […]