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Bare Die Assembly

//Bare Die Assembly
Bare Die Assembly2018-10-03T22:27:59+00:00

ISI has invested heavily in our bare die assembly equipment. Our biggest investment has been in building a team of skilled bare die assembly and wirebonding technicians. Furthermore, ISI is committed to ISO 9001:2008 quality management system and requirements to help ensure consistent product manufacturing standards.

Bare Die Assembly Equipment:

Dedicated Clean Room

  • State-of-the-art bare die assembly / placement machine
    • Placement accuracy of ± 10µm
    • Mixed assembly (SMT + Bare Die)
    • Stacked die assembly
  •  Latest generation wire bonding equipment
    • Bonding capabilities include: gold ball, gold and aluminum wedge, ribbon and deep reach
  • Flip chip
  • Underfill
  • Wafer dicing
  • Conduction/convection wafer reflow oven
  • Precision automated capillary underfill
  • Molded underfill via transfer molding

Technical Know-How + High Tech Equipment = ISI

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Bare die assembly is available for 3D & Advanced Packaging!

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Enabling Technologies

ISI has qualified a variety of stacked bare die techniques. All of these processes are available for use with standard die and do not require custom die or TSVs (through-silicon vias).

IC Packaging

  • Bare die on any substrate: FR4, thin board, flex, rigid flex, exotic materials
  • Die attach gold wire bonding; gold or aluminum wedge bonding
  • Overmolding / contact stamping and forming
  • Encapsulation / glob-top or dam and fill
  • Flip chip including flux, high accuracy placement, reflow and underfill
  • Combination of bare and packaged die enabled reduced form factors
  • High performance organic substrate vs. ceramic provides a cost effective solution
  • Bare die assembly on flex/rigid circuits

3D Stacked Die Stacking

Fig. 2 Multiple same die stacked with spacers

3D Stacked Die Stacking

3D Substrate Stacking

Fig 1. Substrate stacking using bare-dieFig 2. Stacked substrates using packaged devices

Multi-Tier Wire Bond PBGA


Flip Chip PBGA


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