Interconnect Systems, Inc. – 3D Packaging, Advanced Packaging, IC Adapter, Obsolete IC, IC Interposer, BGA Reballing, Custom Interconnect, Standard Interconnect, etc.

Switch to desktop

ISI’s expertise in NEXT LEVEL INTEGRATION blends high density packaging with advanced interconnect technologies to quickly deliver optimized modular solutions. This multi-discipline approach improves performance, reduces size & cost, & speeds time-to-market.

Copyright © Interconnect Systems, Inc. | All rights reserved

Top Desktop version

musicity Are you sure that you want to switch to desktop version?