Since 1987, ISI has delivered advanced packaging and interconnect solutions for top-tier OEMs in a wide range of industries including military, aerospace, data storage and networking, telecom, commercial, supercomputer, medical and industrial. For more than two decades, our products have been designed in business-critical and mission-critical applications such as avionics, medical imaging, night vision, industrial inspection, unmanned aerial vehicles (UAVs), helmet cameras, surveillance equipment, networking equipment, and more.
ISI pioneered the concept and development of Next Level Integration through its design and manufacturing disciplines. Next Level Integration is an alternative design path that integrates at the module level when it is too expensive and time intensive to maximize integration on the silicon. In many designs, Next Level Integration has proven to be cost effective and shortens time-to-market.
ISI’s expertise in Next Level Integration combines high density packaging and advanced interconnect technologies to quickly deliver optimized modular solutions. We offer customers a comprehensive turnkey solution with our design and process development knowledge and extensive manufacturing assets. With our broad capabilities, we are able to quickly execute on Next Level Integration projects that would typically require multiple suppliers and much more time.
- Your one-stop shop for: miniaturized FPGA systems, 3D, stacked die, multi-chip modules, package in/on package, high-density memory modules, hybrid assembly, chip on board, flip chip, IC obsolescence/adapters, connectors, and more.
- Reduce your concept-to-production cycle times with our cost-effective, US-based, multi-discipline design teams and vertically-integrated manufacturing.
- Turnkey or co-developed design services capabilities.
ISI is ITAR Registered, IPC Class III certified, and ISO9001:2008 Certified. With locations worldwide and 200 employees including 70 degreed engineers (and growing!), ISI is uniquely positioned to be your single source provider of advanced packaging and interconnect solutions.
Read more about our broad capabilities and solutions that would best fit your application.