Advanced Packaging

Microelectronics Assembly | Wirebonding | Encapsulation

Advanced Packaging Capabilities Ideal for High-Reliability Applications

Since 1993, ISI has been developing and producing complex, multi-component modules. Composed of bare or packaged die and passive electronics with thermoset epoxy overmolding. ISI’s molded multi-component modules are ideal for miniaturized applications subject to harsh environments.

microelectronics assembly smt

Microelectronics Assembly

Assembly of bare die and components on various substrates/PCBs

  • State-of-the-art bare die placement to ± 10µm
  • Mixed assembly (SMT + Bare Die)
  • Wire bonding equipment
  • Flip chip with solder bump or Cu pillar
  • Pitch down to 50 microns

Wirebonding

Latest generation equipment with capabilities including:

  • Gold, silver, or copper wire
  • Wire diameters down to 15 – 38 microns
  • Min die pad bonding pitch 35 microns
  • Multi-die stacking & wirebonding
  • Pitch down to 50 microns
BARE DIE ASSEMBLY
electronics overmolding encapsulation
RUGGEDIZATION

Encapsulation

Overmolding to ruggedize for harsh environments

  • In-house mold-making and transfer molding
  • Once encapsulated, package is singulated and tested
  • Ideal for miniaturized, rugged applications
  • Modules directly replace obsolete devices
accent image of wire bonding

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