When You Need More Than
a Contract Manufacturer

ISI is Your Co-Design & Manufacturing Partner for Advanced Microelectronics

The ISI Difference:
Beyond Contract Manufacturing

Many companies work successfully with traditional Contract Manufacturers (CMs), and for many projects that approach works well. However, when your product requires deeper engineering involvement or a more integrated process, ISI offers a unique advantage. We operate as a vertically integrated engineering firm, with world-class manufacturing as the final, seamless step. Your project begins with our expert design engineers, who collaborate with you from concept through production. Rather than simply receiving files, we help create them—applying Design for Manufacturing (DFM) principles to optimize performance, reliability, and cost from the start. This engineering-led approach—from initial concept to fully tested production—ensures a smooth, efficient transition to low-to-mid volume realization.

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U.S. Based Design and Manufacturing Facility

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Drastically Reduce Your Product Footprint

Miniaturization:

At ISI, we redefine what’s possible within tight physical constraints. Our engineering teams specialize in advanced Miniaturization techniques, transforming complex electronic systems into ultra-compact modules. This is achieved through expertise in System-in-Package (SiP) methodologies and High-Density Interconnect (HDI) design, which allows us to consolidate multiple discrete components and functions into a single, smaller package.

Whether your challenge is fitting more capability into a fixed size or reducing the overall size of an existing system, we utilize proprietary DFM knowledge to drastically reduce your product’s footprint, turning ambitious size reduction goals into manufacturable reality.

Protection from Extreme Environments

Ruggedized hardware

Ruggedization:

Our expertise extends beyond design and miniaturization to ensuring your mission-critical electronics survive the harshest operating conditions. ISI excels at ruggedizing high-value microchips—including CPUs, GPUs, FPGAs, and ASICs—that are destined for demanding sectors like Aerospace, Defense, and Medical. We achieve superior environmental protection through specialized in-house capabilities such as Electronics Overmolding, which provides a robust barrier against moisture, vibration, shock, and thermal stress. Furthermore, we employ advanced processes like conformal coating to safeguard sensitive components. By integrating this ruggedization expertise early in the design phase (DFM), we guarantee modules that are not only compact and powerful but also exceptionally durable and reliable in the field.

Partner with ISI and Gain an Extended Team of Resources

Cooperative development process

Together, we explore multiple approaches to arrive at the best technical and commercial solution.

Continuously adding capabilities

We are continuously expanding our capabilities,  allowing us to develop and deliver solutions that would typically require managing multiple suppliers.

Quick time-to-market

In-house manufacturing capabilities coupled with Molex’s global footprint make ISI your ideal partner for product development, prototyping, and volume production.

Learn About Working with ISI

Don't just request a quote - Start a design consultation

If you’re seeking a true design partner to help solve complex miniaturization or ruggedization challenges, the first step is a consultation, not a commodity quote. Share your design constraints, performance requirements, or “napkin sketch” with our engineering team, and we’ll discuss the ideal architecture and DFM strategy to bring your custom microelectronic module to fruition.

ISI development process

Start a Design Consultation Now

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