Aircraft Engine Control System

Aircraft photo

CASE STUDY: Aircraft Engine Control System Compact and flexible solution also reduced costs The customer had an aircraft engine control system common to several engine platforms.  The control system monitored and controlled RPM, temperature, vibration, cycles, position, and other critical parameters to optimize engine performance.  The control system was comprised of several sensor boards and […]

Custom Interposer with FPGA

FPGA interposer background image

CASE STUDY: Custom Interposer with FPGA Top: PCB with replacement IC and HiLo pin field, Bottom: HiLo socket matches original footprint Footprint Adapter with Replacement Device A semi-conductor equipment manufacturer was unable to build their equipment due to the long lead-time / unavailability of a FPGA device. The customer located a replacement FPGA device with […]

Circular PCB Stack

circular hilo interconnect

Case Study: Circular Stacked PCBs for volume optimization. Utilized custom HiLo connector to maximize real estate for components.

Redundant Capacitor Module

Redundant capacitor illustration

CASE STUDY: Redundant Capacitor Assembly CAPACITOR MODULE CHALLENGE:  Tantalum Capacitors were a single point of failure in critical weapons system Replacement and field failures are extremely expensive SOLUTION: ISI solution provided two capacitors in series, providing redundancy if one cap shorts Unique approach allowed twin capacitor module to be placed on SMT footprint of original […]

Locomotive Black Box Recorder

Illustration of black box recorder

CASE STUDY: Locomotive Black Box Recorder STORAGE DEVICE Assembly required to withstand an ‘event’ defined as 260C for 11 hours High temp PCB, components and solder selected Miniaturization to fit within very restricted size envelope Memory devices are socket with a custom high-temp HiLo socket, facilitating remote data download ISI assembly passed the customer’s rigorous […]

Infrared Camera Image Pre-Processor

Infared camera module compared to US quarter

CASE STUDY: IR Camera Image Pre-Processor Image Pre-Processor Module Today’s silicon memory and processor solutions are getting increasingly complex. Couple that with the challenges of miniaturization, and you are faced with much more engineering work to arrive at a reliable, commercially viable solution. This case study focuses on an image pre-processing module for an infrared […]

Intel Atom Processor and DDR 3 Memory

Bare module before overmolding

CASE STUDY: Intel Atom Processor + DDR 3 Memory Bare module before overmolding Microprocessor + Memory Module (SiP) Compute module for control systems on commercial aircraft Modularization allows re-use of module in multiple applications on multiple aircraft Lifecycle Management: Module configuration allows for future IC upgrades, while maintaining original footprint Module was ruggedized with overmolding […]