2019 IEEE 69th ECTC - Electronic Components and Technology Conference The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Engage in important industry research topics. Topics for this year's symposium include: Heterogeneous Integration, Electronic Materials, Thermal Challenges, 2.5D & 3D Packaging, Power Electronics, Flexible & Additive Electronics, Sensors & Embedded Electronics, Automotive & Harsh Environments, Photonics & MEMS and Materials for Energy Storage. The 30th annual Binghamton University and GE Electronics Packaging Symposium is the premier electronics manufacturing [...]
IMAPS 2016 is the LARGEST Conference Program for Microelectronics, Assembly, 2.5/3D, Emerging Applications, Materials & Advanced Packaging in the FALL of 2016: 3 Days, 25 Sessions, 5 Keynotes, 140+ Speakers Join us at IMAPS 2016 from October 10th to 13th at the Pasadena Convention Center in Pasadena, California and participate in the many events that are planned [...]
CAMARILLO, CALIF. – October 9, 2014 – ISI (www.isipkg.com), a leading provider of advanced packaging and interconnect technologies, today announced it will showcase its latest advanced/3D packaging and high-density interconnect products at IMAPS 47th International Symposium on Microelectronics being held October 13-16, 2014 at Town and Country Resort and Conference Center, San Diego, CA. Visitors [...]