Custom Interposer with FPGA
CASE STUDY: Custom Interposer with FPGA Top: PCB with replacement IC and HiLo pin field, Bottom: HiLo socket matches original footprint Footprint Adapter with Replacement Device A semi-conductor equipment manufacturer was unable to build their equipment due to the long lead-time / unavailability of a FPGA device. The customer located a replacement FPGA device with […]
Circular PCB Stack
Case Study: Circular Stacked PCBs for volume optimization. Utilized custom HiLo connector to maximize real estate for components.
Locomotive Black Box Recorder
CASE STUDY: Locomotive Black Box Recorder STORAGE DEVICE Assembly required to withstand an ‘event’ defined as 260C for 11 hours High temp PCB, components and solder selected Miniaturization to fit within very restricted size envelope Memory devices are socket with a custom high-temp HiLo socket, facilitating remote data download ISI assembly passed the customer’s rigorous […]