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epsymposium

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Electronics Symposium

By |2018-08-29T18:06:22+00:00September 18th, 2018|

Engage in important industry research topics.  Topics for this year's symposium include: Heterogeneous Integration, Electronic Materials, Thermal Challenges, 2.5D & 3D Packaging, Power Electronics, Flexible & Additive Electronics, Sensors & Embedded Electronics, Automotive & Harsh Environments, Photonics & MEMS and Materials for Energy Storage. The 30th annual Binghamton University and GE Electronics Packaging Symposium is the premier electronics manufacturing [...]

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