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/Tag: 2018

Electronics Symposium

By |2018-08-29T18:06:22+00:00September 18th, 2018|

Engage in important industry research topics.  Topics for this year's symposium include: Heterogeneous Integration, Electronic Materials, Thermal Challenges, 2.5D & 3D Packaging, Power Electronics, Flexible & Additive Electronics, Sensors & Embedded Electronics, Automotive & Harsh Environments, Photonics & MEMS and Materials for Energy Storage. The 30th annual Binghamton University and GE Electronics Packaging Symposium is the premier electronics manufacturing [...]

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By |2018-01-15T17:13:38+00:00January 31st, 2018|

Expo Hall Hours: Wednesday, January 31 12:30 p.m.–6:00 p.m. Thursday, February 1 12:30 p.m.–6:00 p.m. Where the Chip Meets the Board Join ISI and Molex, booth #633 DesignCon offers an in-depth, three-day conference program curated by our Technical Program Committee (TPC) — an expert panel of more than 90 industry professionals. With over 100 technical paper sessions, [...]

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