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Modules & Adapters

//Modules & Adapters
Modules & Adapters2018-10-03T22:27:54+00:00

High-Density Memory Module

ISI is a leader in high-density memory module packaging. Today’s solutions draw from our 25 year history in IC packaging. Our high-density memory modules are currently in volume production with industry leaders in mil/aero, telecom, medical and computing industries.

About our high-density memory module technology:

Achieves high-density packaging through a combination of several technologies:

  • Very thin laminate substrates
  • Unique 3D interconnect solutions
  • High-density SMT placement
  • Void-free overmold of module assemblies using semiconductor-grade transfer molding process
  • Can often achieve very high-density utilizing standard package devices rather than bare die:
    • No bare die processing or assembly required
    • Fully-tested parts = simpler testing and high manufacturing yield
  • Is cost-effective in low, medium and high volume applications
High Density Memory Module
High Density Memory Module

Molded Multi Component

High Density / Rugged Environments / Cost Effective

Molded Multi-Component Modules (MMCM) are designed for miniaturized, rugged applications. These modules can be used as a rugged system in package, an IC replacement for obsolescence or cost reduction, or high-density memory modules. Ideal for a wide range of industries including military, telecom, aerospace, automotive and high performance computing, MMCM solutions improve cost and reliability for custom applications.

MMCM products consist of bare or packaged die and passive electronic components overmolded with thermoset epoxy. The use of thermoset epoxy to encapsulate the assembly provides good protection to withstand extreme heat, vibration, shock, and moisture for applications operating in harsh environments. Overmolding also prevents chemical exposure to components and reduces stress from thermal expansion.

ISI’s innovative 3D packaging techniques provide a reliable and durable overmolded module:

  • Use the latest epoxy thermoset materials
  • Underfilling and overmolding process executed simultaneously
    • Small particle sizes used for underfill of BGAS, flip chips, and wirebond encapsulation
  • Advanced thermal analysis implemented to determine heat dissipation solution
  • ISI incorporates custom designed heatsink solutions for thermal issues
  • 100% automated optical inspection process checks and verifies lead true position, co-planarity, flatness, and other critical dimensions

Cost Reduction Module

As an alternative to increasing the layer count on a motherboard, Cost Reduction Modules (CRMs) from ISI isolate high-density circuitry into just a few square inches. We have the expertise, enabling technologies, and the products to help you implement a Cost Reduction Module Program.


Higher levels of IC integration require higher density packages.

  • Package pin counts are increasing
  • Package pitch is decreasing

High-density packages require high-density PCBs.

  • Fine line and space
  • High layer count
  • Blind and buried vias
  • Laser drilled microvias
  • Matched length and impedance

High-density PCBs can be a significant cost factor.

  • Reduced supplier base
  • Lower yield 2x – 6x cost increase

In many cases, only a small percentage of the area on the motherboard requires high-density PCB rules:

  • Microprocessor + Memory
  • ASIC + Memory
  • FPGA + Memory

Fan-Out Interposers

Convert microBGA package to larger pitch

A fan-out interposer converts a microBGA package to a larger pitch that is suitable for larger, thicker PCBs. For example, a 0.5mm pitch device can be converted to a 1mm pitch ball array, eliminating the additional costs associated with microvias and underfilling on the PCB. This allows the use of the latest, most cost-effective ICs without increasing the cost of the system PCB.

Reduces motherboard complexity:

  • Reduce layer count
  • Eliminate blind & buried vias
  • Utilize standard line and space
  • Isolates underfill requirements

Flex Circuit Assembly

Through the use of unique design techniques and assembly processes, ISI can significantly reduce the size and cost of complex circuits.

Through the use of unique design techniques and assembly processes, ISI can significantly reduce the size and cost of complex circuits.

Advantages that designing
with Flex Circuits can offer:

  • Size reduction
  • Weight reduction
  • Reduced assembly time and costs
  • Increased system reliability
  • Improved controlled impedance signal
  • Improved heat dissipation capability
  • Wiring harnesses and connectors can be eliminated to reduce costs and improve reliability

 ISI Capabilities:

  • Design and assembly
  • Flex Assemblies
  • Rigid Flex Assemblies
  • Flex Interconnect

 ISI has experience with all common construction methods:

  • Polyimide, Polyester, and Teflon base materials
  • Adhesive and adhesiveless systems
  • Copper and aluminum conductors
  • 3 mil trace line and space standard; custom designs down to 1 mil line and space
  • Single or double sided, single or double access
  • Single or double sided, single or double access
  • Multi-layer flex applications
  • Static and dynamic flex applications
  • Assembly of through-hole, surface mount and bare die components
  • Miniature flex assembly
Flex Circuit Assembly

Q-Stack Power Delivery Module

Eliminate the need for decoupling capacitors

Q-Stack power delivery modules eliminate or reduce the need to add decoupling capacitors around the perimeter of your ASIC or FPGA. The Q-Stack design moves the de-coupling caps to the bottom of the device, which frees up valuable board space and shortens power delivery path.

ASIC Emulation Module

ASIC Emulation Modules reduce time-to-market by allowing customers to develop and test hardware and software while waiting for ASIC to arrive. It is generally centered around high gate-count FPGA or existing/prototype ASIC and may also include memory, VR, passives, and connectors for test equipment.

ASIC Emulation Module Advantages

  • Reduces risk of having to re-spin ASIC
  • HiLo Interconnect is a key enabling technology for most projects:
    • Allows pinned module to plug into HiLo socket soldered to BGA footprint.
    • Final ASIC can be pinned and plugged into same socket (Use the same board for module or ASIC)

Contact ISI with your Microelectronics needs