FlexFrame Interconnect is a module-level interconnect technology that enables multi-component modules to be placed on printed circuit boards to act as an adapter to apply the same process as a standard leadframe package. FlexFrame Interconnect is available with a wide range of pin locations, pitches, and standoff heights. Flexibility is also enhanced by windows that enable components to be placed in the center of a module.
FlexFrame adapters utilize phosphor-bronze pins that are arrayed in a carrier and formed to emulate gullwing or J-leads. Carriers are constructed of laminates with coefficients of thermal expansion compatible with host PCBs.
ISI provides 100% automated optical inspection of FlexFrame leads for position, flatness and coplanarity per JEDEC specifications. These adapters are shipped in tape and reel packaging ready for placement using standard SMT equipment.
These rugged interconnects have been qualified for use in high-reliability military, aerospace, telecom, networking, server, and industrial applications.