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ISI Delivers Molded Multi-Component Modules for Miniaturized, Rugged Applications

//ISI Delivers Molded Multi-Component Modules for Miniaturized, Rugged Applications

ISI Delivers Molded Multi-Component Modules for Miniaturized, Rugged Applications

New MMCM Product Line Improves Cost and Reliability for Custom Applications

CAMARILLO, CALIF. – Interconnect Systems Inc. (ISI), a leading provider of advanced electronics packaging and interconnect technologies, announced today the availability of molded multi-component modules (MMCM) designed for applications in rugged, miniaturized environments. The new MMCM product line improves cost and reliability for custom applications within a wide range of industries including military, telecom, aerospace, automotive and high performance computing.

MMCM solutions consist of bare or packaged die and passive electronic components overmolded with thermoset epoxy. These modules can be used as a rugged system in package, replacements for obsolete ICs, or high density memory modules. The use of thermoset epoxy to encapsulate the assembly provides good protection to withstand extreme heat, vibration, shock, and moisture for operation in harsh environments. In addition, overmolding prevents chemical exposure to components and reduces stress from thermal expansion.

“Many of our customers are looking for ways to shrink their electronic designs while meeting the reliability challenges faced in critical applications,” said Mark Gilliam, vice president of sales and marketing at ISI. “With ISI’s in-house design and state-of-the-art manufacturing facilities, we provide customers an affordable way to ruggedize and miniaturize electronic assemblies.  Through our co-development process, we engage early and closely with customers to optimize product design and reduce time-to-market.”

ISI’s innovative 3D packaging techniques and use of the latest epoxy thermoset materials provides for a reliable and durable overmolded module. The underfilling and overmolding process is executed simultaneously, resulting in a simplified manufacturing process. Small particle sizes are used for underfill of BGAs, flip chips, and wirebond encapsulation. For high wattage modules, ISI performs a thorough thermal analysis and incorporates custom heatsinks when required.

ISI develops final test procedures to verify quality on 100 percent of modules shipped.  This can include automated optical inspection to verify critical dimensions including lead true position, co-planarity, and flatness, as well as electrical functional test and boundary scan.