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IMAPS 2016 – International Microelectronics Assembly & Packaging Conference

//IMAPS 2016 – International Microelectronics Assembly & Packaging Conference
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IMAPS 2016 is the LARGEST Conference Program for Microelectronics, Assembly, 2.5/3D, Emerging Applications, Materials & Advanced Packaging in the FALL of 2016:
3 Days, 25 Sessions, 5 Keynotes, 140+ Speakers

Join us at IMAPS 2016 from October 10th to 13th at the Pasadena Convention Center in Pasadena, California and participate in the many events that are planned for IMAPS 2016.

You will find a “revamped” IMAPS 2016 program with technical sessions balancing between emerging, new and mature topics, and a large cross-section of vendors exhibiting their products and technologies in the exhibition hall.

The IMAPS 2016 committees and many dedicated volunteers have been working together over the past six months to prepare for the 2016 Symposium with an emphasis on bringing exciting topics that are relevant within the microelectronics community. This year’s Technical Committee, chaired by Dan Krueger, is currently preparing technical sessions with topics ranging from high reliability systems to fan-out wafer level and embedded packages. The conference theme for IMAPS 2016 is “Packaging the Connected World.” Building on the successes of the previous symposia, the technical program in 2016 will also run parallel tracks covering:

EMERGING APPLICATIONS & THE CONNECTED WORLD;
2.5/3D PACKAGING & EMBEDDED PACKAGING TECHNOLOGIES;
ADVANCED PACKAGING AND ENABLING TECHNOLOGIES;
ADVANCED MATERIALS & PROCESSES; and
MODELING, DESIGN, TEST & RELIABILITY
.

Complementing the technical sessions, we are also planning multiple Professional Development Courses (PDCs) with variety of topics bound to enhance and broaden your technical portfolio. This will be held on Monday, October 26, prior to the kick-off of the technical sessions.

The IMAPS 2016 Exhibition returns featuring a 2-day show floor with more than 120 exhibit booths already reserved, featuring companies and research labs that will showcase a vast array of new products serving all segments of the microelectronics industry, including Consumer, Healthcare and Biomedical, Military, Aerospace, Computing, and Automotive/Industrial. Browsing the exhibit hall and talking to the exhibitors are bound to be exciting and we hope that this enables you to learn the latest and greatest solutions to the changing needs in your business and research.

We hope you can take some time from your busy schedules to attend IMAPS 2016, to learn about the changing world of microelectronics packaging in the 21st century. Next stop: Pasadena!