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IMAPS 2018

//IMAPS 2018
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ISI is exhibiting once again at the IMAPS Intenational Symposium on Microelectronics. Please join us for a few days informative discussions and exhibition about semiconductor packaging and miniaturization.

The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on:

TRACK 1:
SiP/SiM (System Solutions)
TRACK 2:
Wafer Level/Panel Level (Advanced RDL)
TRACK 3:
High Performance / High Reliability
TRACK 4:
Flip Chip/2.5D/3D/Optical (Advanced Package)
TRACK 5:
Advanced Process & Materials (Enabling Technologies)

PLANNED SESSIONS:

• System Design & Integration
• CPI & Modeling
• Embedded/High Voltage
• Optical/Automotive
• Wearable / Test

PLANNED SESSIONS:

• Wafer-Level Fan Out
• WLCSP
• Advanced Fan Out
• Panel-Level Fan Out
• MEMS & Sensors

PLANNED SESSIONS:

• High Reliability – Defense/Aero
• MM Wave / High-Speed Packaging
• RF/Wireless Components
• High Reliability in Bio/Medical
• High Reliability in Extreme Environments

PLANNED SESSIONS:

• Large Body / Small Body FC
• 2.5D Technologies
• Optical 
• BUMP & Interconnect
• 3D Technologies

PLANNED SESSIONS:

• Substrate Technology
• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond
• Advanced Equipment & Additive Manufacturing

TRACK 6:
INTERACTIVE POSTER SESSION – “Posters & Pizza Lunch”