September 18, 2018 - September 19, 2018
Engage in important industry research topics.
Topics for this year’s symposium include: Heterogeneous Integration, Electronic Materials, Thermal Challenges, 2.5D & 3D Packaging, Power Electronics, Flexible & Additive Electronics, Sensors & Embedded Electronics, Automotive & Harsh Environments, Photonics & MEMS and Materials for Energy Storage.
The 30th annual Binghamton University and GE Electronics Packaging Symposium is the premier electronics manufacturing conference in the Northeast. The conference features more than 50 invited technical presentations by academic, industry, and government leaders, influencers, and decision makers. The program includes an IEEE Electronics Packaging Society-sponsored workshop on Heterogeneous Integration, student poster session, lab tours, and exhibits.
Session topics for 2018 will include:
- 2.5/3D Packaging
- 5G Needs in Packaging
- Automotive & Harsh Environments
- Flexible & Additive Electronics
- Materials for Packaging & Energy Storage
- Power Electronics
- Sensors, Embedded Electronics & IoT
- Thermal Challenges
- Wearable and Flexible Electronics for Medical Applications