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Q-Stack Power Delivery Modules

Applications
A decoupling method that reduces board space and improves power delivery
A Q-Stack Module is a small PCB with decoupling capacitors on one side, and solder balls on the bottom

Q Stack figue 1
The Q-Stack solution is to move the de-coupling caps to the bottom of the device.
This requires an interface board, or a ‘Q-Stack Module’.

Bottom without Q-Stack
 
Bottom with Q-Stack
 
Advantages
Q-Stack eliminates or reduces the need to add decoupling capacitors around the perimeter of your ASIC or FPGA, thus freeing up valuable board space
Q-Stack shortens the power delivery path, which reduces inductance and improves
power delivery performance
 

Q-Stack. PDF








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