BGA Termination Modules terminate or re-route signals on a BGA land pattern where an expensive BGA device is not required. They reduce cost by utilizing one standard motherboard for multiple product configurations.
- Allows for fewer, standardized motherboard designs, reducing inventory of multiple motherboard designs
- Provides increased configure-to-order flexibility and reduced leadtimes
- Design and performance can be enhanced with ISI's HiLo Socketing System to populate either BGA or termination module without soldering