Interconnect Systems, Inc. – 3D Packaging, Advanced Packaging, IC Adapter, Obsolete IC, IC Interposer, BGA Reballing, Custom Interconnect, Standard Interconnect, etc.

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BGA Termination Modules

BGA Termination Modules terminate or re-route signals on a BGA land pattern where an expensive BGA device is not required. They reduce cost by utilizing one standard motherboard for multiple product configurations.

Advantages

  • Allows for fewer, standardized motherboard designs, reducing inventory of multiple motherboard designs
  • Provides increased configure-to-order flexibility and reduced leadtimes
  • Design and performance can be enhanced with ISI's HiLo Socketing System to populate either BGA or termination module without soldering
  • BGA Termination Module
  • BGATerminator Module with Termination and Timing Delay
  • BGA Terminator with HiLo Socket

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