Interconnect Systems, Inc. – 3D Packaging, Advanced Packaging, IC Adapter, Obsolete IC, IC Interposer, BGA Reballing, Custom Interconnect, Standard Interconnect, etc.

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Enabling Technologies

ISI has qualified a variety of stacked die techniques. All of these processes are available for use with standard die and do not require custom die or TSVs (through silicon vias).

IC Packaging

  • Bare die on any substrate: FR4, thin board, flex, rigid flex, exotic materials
  • Die attach gold wire bonding; gold or aluminum wedge bonding
  • Encapsulation, glob-top or dam and fill
  • Flip chip including flux, high accuracy placement, reflow and underfill
  • Combination of bare and packaged die enabled reduced form factors
  • High performance organic substrate vs. ceramic provides a cost effective solution
  • Bare die assembly on flex/rigid circuits

3D Stacked Die Packaging
Various die, tiered wire bond
Fig. 1 Various die, tiered wire bond
Multiple same die stacked with spacers

Fig. 2 Multiple same die stacked with spacers

Flip chip + tiered wire bond

Fig. 3 Flip chip + tiered wire bond

Center bond using Z-controlled die attach

Fig. 4 Center bond using Z-controlled die attach

3D Stacked Substrates Packaging

ISI designs and manufactures unique z-axis interconnect to facilitate stacking of thin substrates. Our high density area array interconnect (down to 0.4mm pitch) provide stacked, molded packaging using bare die or packaged devices.

Stacked, molded packaging using bare die

Fig 1. Stacked, molded packaging using bare die 

Stacked, molded packaging using packaged devices

Fig 2. Stacked, molded packaging using packaged devices

Rugged Overmolded Module Packaging
ISI’s molded underfill is a transfer molding process that utilizes an ultra-fine particle-size thermal-set epoxy. Thermal set epoxy is the same base material type used in standard BGA and QFP packages (typical material has larger filler size). Utilizing fine-particle size, and vacuum-assist, the process provides void-free underfill of BGAs, leaded components and flip chip devices, as well as encapsulate wirebonds without wire sweep.
 
Overmolded 3D modules withstand harsh-environment shock, vibration, humidity, and temperature cycling. This process is cost effective at any quantity for a wide range of memory and processor applications. Our design services include module and board-level mechanical and thermal stress analysis.Stacked, molded packaging using bare die
Fig 1. Stacked, molded packaging using bare dieStacked, molded packaging using packaged devices
Fig 2. Stacked, molded packaging using packaged devicesCross section of overmold
Fig 3. Cross section of overmold
 
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