IC Die Packaging
IC Packaging
ISI was founded to commercialize low cost, high performance organic IC packages as an alternative to ceramic packages.
Today ISI specializes in application specific IC packages with pin counts from 8 to 2000+. Our packages have been qualified by leading semiconductor companies including
Fairchild, Intel, Motorola, Philips, and Texas Instruments.
ISI has design and manufacturing capabilities for flip chip and wirebond packaging.
Many of our designs include an integrated heat spreader to accommodate
high wattage die.
ISI has designed over 150 packages for applications ranging from high performance, moderate volume to low cost, high volume. With our design tools and two decades of experience, we can turn a design for a new project in a few weeks.
Bare Die Assembly Capabilities
Bare Die Capabilities
Facilities Tour
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