HiLo Flexible Interconnect System

Standard Products & Drawings
Technical Specifications
Application Guide. PDF
Contact ISI   to request reliability test report & electrical characterization reports

Applications Board-to-Board Mezzanine Card BGA Socketing Custom solutions for unique land patterns Tight, limited motherboard space - Connector array size similar to standard BGA package - The height of a mated pair can be as low as 3mm High-speed designs - 1dB loop-thru bandwidth measured at 9.3 GHz High Density designs - Standard 0.8mm,1mm & 1.27mm pitch and above - Mixed pitch Complex mixed pitch & high I/O count requirements ISI’s HiLo and custom board-to-board interconnect products are currently used in Military, Aerospace and High-Rel applications.

	Unlimited I/O & Design Flexibility - can array the I/O in any pattern - any I/O count - mixed pitch - custom pitch - Currenty building 2000+ I/O count designs in high volume
	Speed to Market - designs in 48 hours - sample parts in 2 weeks - ramp to high volume production in 3 weeks
	Low NRE - as low as $ 750 NRE
	Low Cost - priced as low as $0.02/contact per mated set in production volumes
	Up to 10 amps per contact requiring fewer conacts to handle power and ground
	HiLo Interconnect is a key enabling technology for most projects: - Modules - Fan-Out Interposers. - Footprint Conversion Adapters - RoHS Conversion Solutions
	Availability - production capacity exceeds 1 billion contacts per year - high speed, automated: laminating, drilling, moulding, routing, contact insertion
Test reports from Contech Research and Gigatest Labs are available upon request. Contact ISI
Our Standard Products guide (below) now lists 54 standard part numbers for 1mm BGA packages from Actel, Altera, QuickLogic and Xilinx.
If you don't see your BGA package in our Standard Products please contact ISI. We have more than 250 additional standard HiLo configurations and custom footprints can be designed in just one week.