Flex Circuit Assemblies

ISI has extensive flex circuit design & assembly expertise...

Capabilities

High-Rel SMT bonding Flex Assemblies Rigid Flex Assemblies Flex Interconnect ISI has experience with all common construction methods: Polyimide, Polyester, and Teflon base materials Adhesive and adhesiveless systems Copper and aluminum conductors 3 mil trace line and space standard; custom designs down to 1 mil line and space Single or double sided, single or double access Single or double sided, single or double access Multi-layer flex applications Static and dynamic flex applications Assembly of through-hole, surface mount and bare die components Miniature flex assembly Through the use of unique design techniques and assembly processes, ISI can reduce the size and cost of complex circuits.

Advantages

The muliple advantages of Flex Circuits are exponentially increasing use and application:
	Size Reduction - Among the thinnest dielectric substrates available for electronic interconnection Weight Reduction - Reduces the weight of an electronic package significantly
	Reduced Assembly Time and Costs - Seamlessly integrate form, fit and function - Provide an excellent means of reducing assembly time - Reduce the number of assembly operations required - Can construct and test prior to committing the circuit to assembly
	Increased System Reliability Reliability - Reduces the number of levels of interconnection required in an electronic package
	Improved Controlled Impedance Signal Transmission Design - Materials are very uniform in both thickness and electrical properties. - Facilitates the production of circuits needed for high-speed packaging applications
	Improved Heat Dissipation Capability - Greater surface-to-volume ratio than round wire - Short thermal path
	Wire harnesses and connectors can be eliminated to reduce cost and improve reliability