Downloads

Exhibition & Conference Schedule

ISI Brochure
ISI's latest 12 page color brochure highlighting Next Level Integration projects,
obsolescence solutions, advanced packaging, HiLo, custom interconnect and
integrated capabilities. For high quality hard copies please contact us.
ISI Brochure.PDF (8.3MB)

ISI Capabilities Overview
A printable 5 page overview of ISI's Design, Process, Manufacturing, Inspection & Testing capabilities in more detail than the ISI Brochure.
ISI Capabilities.PDF(3.7MB)

Reballing
Lead Free Solder Sphere removal and replacement with eutectic leaded spheres.
ISI Reball Process.PDF
ISI Reball Checklist.PDF

Footprint Conversion Adapters & IC Obsolescense Solutions
ISI designs approximately 150 new adapters each year to solve IC obsolescence and shortages for customers such as Agilent, BAE, Cisco, Fairchild, Harris, IBM, Lucent, Motorola, Nortel, Texas Instruments and Xerox tprint Conversion Adapters.
ISI Footprint Conversion Adapters.PDF

Fan-Out Interposers
A recently ISI published white paper highlighting the speed-to-market and cost advantages of using an interposer to convert microBGAs to standard pitch BGAs
Fan-Out Interposer White Paper.PDF

HiLo
ISI’s Flexible Interconnect System
for both Board to Board and BGA Socketing applications.
HiLo Guide.PDF
HiLo Standard Products & Drawings

Q Stack
Reviews this decoupling method that conserves board space and improves power delivery.
ISI Q Stack.PDF

PC104 & PC104 Plus
ISI PC104 Data Sheet.PDF
ISI PC104 General Specifications.PDF
ISI PC104 Standard Products & Drawings

ISI Print Ads
ISI Obsolescence Solutions.GIF
ISI Fan Out Interposer.GIF
ISI Reballing.GIF
ISI Power Supply Sockets.GIF
ISI HiLo.GIF

Educational Materials
A reference to microelectronics acronyms & terminology.
Microelectronics Terminology