ISI’s expertise in NEXT LEVEL INTEGRATION blends high density packaging with advanced interconnect technologies to quickly deliver optimized modular solutions. This multi-discipline approach improves performance, reduces size & cost, & speeds time-to-market.
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Bare Die Assembly
3D and advanced IC packaging equipment:
- Class 1000 clean room
- Wafer saw
- Conduction/convection wafer reflow oven
- Precision automated capillary underfill
- Molded underfill via transfer molding
- State of the art die placement machine
- Placement accuracy of ± 10µm
- Latest-generation wire bonding equipment
- Bonding capabilities include: gold ball, gold and aluminum wedge, ribbon, and deep reach
