Interconnect Systems, Inc.

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ISI’s expertise in NEXT LEVEL INTEGRATION blends high density packaging with advanced interconnect technologies to quickly deliver optimized modular solutions. This multi-discipline approach improves performance, reduces size & cost, & speeds time-to-market.

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Advanced SMT Manufacturing

State-of-the-art SMT assembly line:

  • Solder stencil printers with 2.5D paste inspection
  • SMT chip shooter with 01005 placement capacity
  • SMT pick-and-place equipment with 3" square bottom vision capability
  • Eight plus two zone convection reflow ovens
  • Precision dispensing equipment with positive displacement pumps
  • Wave soldering
  • BGA rework station

 

  • Ekra Screen Printer
  • Fuji NXT Chipshooter
  • Fuji CP732 Chipshooter
  • SMT Chipshooter Placement

  • Samsung SM421 Pick and Place
  • Fuji QP351 Pick and Place
  • Heller Reflow Ovens
  • Grieve Batch Ovens for Bake and Cure

  • Precision Dispense
  • Aqueous Trident Cleaning System
  • BGA Rework Station
  • SMT Line

  • Scienscope X-Ray

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