ISI’s expertise in NEXT LEVEL INTEGRATION blends high density packaging with advanced interconnect technologies to quickly deliver optimized modular solutions. This multi-discipline approach improves performance, reduces size & cost, & speeds time-to-market.
ISI’s HiLoTM Flexible Interconnect System for board-to-board and or mezzanine card applications, can be designed in 48 hours, delivering sample parts in 2 weeks and full-scale production in 3 weeks.
The system is compatible with high-speed designs, with the 1dB loop-thru bandwidth measured at 9.3 GHz. The height of a mated pair can be as low as 3mm.
Interconnect Systems is currently shipping pin fields and socket sets with more than 2000 I/O. Contact pitch is typically 1.27 or 1.0 mm, and custom pitches are available.
The product was named for the Highs, the Lows, and the Flexibility that today’s industry requires.
Test reports of Contech Research and Gigatest Labs are available upon request.
The HiLo system is flexible in that a customer can array the I/O in any pattern, and have sample parts in two weeks for less than $1000 NRE.
The HiLo Flexible Interconnect is priced as low as $0.02/contact per mated set in production volumes.