Interconnect Systems, Inc. – 3D Packaging, Advanced Packaging, IC Adapter, Obsolete IC, IC Interposer, BGA Reballing, Custom Interconnect, Standard Interconnect, etc.

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Advanced SMT Manufacturing

State-of-the-art SMT assembly line:

  • Solder stencil printers with 2.5D paste inspection
  • SMT chip shooter with 01005 placement capacity
  • SMT pick-and-place equipment with 3" square bottom vision capability
  • Eight plus two zone convection reflow ovens
  • Precision dispensing equipment with positive displacement pumps
  • Wave soldering
  • BGA rework station
  • Conformal coating machine

 

  • Ekra Screen Printer
  • Fuji NXT Chipshooter
  • Fuji CP732 Chipshooter
  • SMT Chipshooter Placement
  • Samsung SM421 Pick and Place
  • Fuji QP351 Pick and Place
  • Heller Reflow Ovens
  • Grieve Batch Ovens for Bake and Cure
  • Precision Dispense
  • Aqueous Trident Cleaning System
  • BGA Rework Station
  • SMT Line
  • Scienscope X-Ray
  • PVA Conformal Coating Machine

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