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Microelectronics Solutions
Miniaturization
Ruggedization
Smart Sensors
System-in-Package (SiP)
IC Lifecycle Management
Capabilities
Interconnect
Advanced Packaging
Design
Manufacturing
BGA Reballing
Products
RFSoC Cards
XMC FPGA Cards
MICTOR Cables/Adapters
Pogo Pin Catalog
Standard Connectors
Resources
Case Studies
Blog
Ruggedization Study
Interposer Guide [PDF]
About
About ISI
Working with ISI
Contact ISI
Support
Certifications
Careers
Capabilities
Interconnect, Advanced Packaging, Design, and Manufacturing
Our
IN HOUSE
capabilities from our California facility are ready for
fast turn
protos and
production
Interconnect
Custom and Standard Connectors, Pogo Pins, and Cables
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Advanced Packaging
Microelectronics Assembly, Wirebonding, and Encapsulation
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Design
System Level Engineering, PCB & Substrate Design, Packaging, and Interconnect
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Manufacturing
Vertically Integrated, US-Based, ITAR-Compliant Manufacturing Facility
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