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BGA Termination Modules

Applications
Terminate or re-route signals on a BGA land pattern
where an expensive BGA device is not required
Reduce cost by utilizing one standard motherboard for multiple product configurations
- Semiconductor advancements allow you to fit all configurations on a single PCB
- Your product is shipped in multiple configurations to accommodate different performance and price points yet still requires carrying inventory of each configuration


BGA Termination Module with re-routed traces

Advantages
Allows for fewer, standardized motherboard designs
- Reduces inventory of multiple motherboard designs
Provides increased configure-to-order flexibility and reduced leadtimes
- ISI termination modules can be used as needed when module is not populated
Socketed and soldered interconnect options available
Design and performance is enhanced with ISI's HiLo Socketing System to populate either BGA or Termination Module without soldering






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