 |
Dimensional specifications and processes are tailored to each part |
|
Specific control parameters for each phase of handling, production, controls for temperature, humidity, ESD protection, ball size/position tolerance specifications, automation, cleanliness, inspection and repackaging are clearly defined and indicated |
|
Incoming Inspection procedures in place per QAP |
|
MSL (Moisture Sensitivity Level) requirements are strictly observed |
|
Ball Removal process is determined and specified based on the part to control temperature and protect the solder ball pads of each device |
|
Ball Replacement utilizing in house high efficiency and high accuracy assembly tooling for ball placement |
|
Controlled Solder Profiles using zone controlled reflow ovens |
|
First Piece Inspection prior to line production |
|
Post Ball Attach Cleaning with cleanliness procedures monitored and measured using
an Ionograph as required |
|
Part Marking available per customer specifications on request |
|
100% Automated Optical Inspection using Nikon Nexis or RVSI model LS6000 for documented true position, co-planarity and flatness as required |
|
Final Inspection per QAP |
|
Package in either customer supplied packaging, JEDEC trays or tape & reel per EIA-481
with nitrogen purged dry pack bags |
All work is performed at the Interconnect Systems, Inc. ISO 9001:2000 Certified facilities in Camarillo, California. This ISI facility is currently Reballing in both high and low production volumes. |
|
ISI Reballing Summary.PDF
ISI Reballing Checklist.PDF
Inspection & Testing
|
