Broad Capabilities
Design
Advanced SMT
Bare Die Assembly
Connector MFG
Quality
Testing & Inspection
Facilities Tour
Custom Modules
Cost Reduction Modules
Fan-Out Interposers
BGA Termination Modules
ASIC Emulation Modules
Q Stack Power Delivery
Interconnect
HiLo Interconnect
Custom Interconnect
Power Supply Sockets
PC104 - PC104+
Die Packaging
Advanced Packaging
Optical Die Packaging
IC Packaging
Obsolescense Solutions
BGA Adapters
Leadframe Adapters
PGA - DIP Adapters
RoHS Lead Free Solutions
BGA Reballing
BGA Interposers
Flex Circuit Assemblies
Flex Assemblies
Bare Die Assembly
Advanced IC Packaging
Bare die on any substrate: FR4, thin board, flex, rigid flex, exotic materials
Die attach
Gold wire bonding; gold or aluminum wedge bonding
Encapsulation, glob-top or dam and fill
Flip chip
- Flux
- High Accuracy Placement
- Reflow
- Underfill
Combination of bare and packaged die is used to provide reduced form factor
Organic substrate vs. ceramic provides a cost effective solution
Facilities Tour
Capabilites Overview.PDF
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