Interconnect Systems, Inc.
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ASIC Emulation Modules

Applications
Typically used in prototyping and sometimes in early production runs so OEMs can get first systems to their customer
Is generally centered around high gate-count FPGA or existing/prototype ASIC
May also include memory, VR, passives, and connectors for test equipment
Design is typically centered around a lower-technology FPGA

Advantages
Reduces time-to-market by allowing customer to develop and test hardware and
software while waiting for ASIC to arrive
Reduces risk of having to re-spin ASIC
HiLo Interconnect is a key enabling technology for most projects:
- Allows pinned module to plug into
- HiLo socket soldered to BGA footprint.
- Final ASIC can be pinned and plugged into same socket
(Use the same board for module or ASIC)


HiLo Interconnect





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